NIST's CHIPS Program Office (CPO) announces the Final Programmatic Environmental Assessment and FONSI for federal financial assistance to modernize or expand existing semiconductor fabrication facilities within their current footprints under the CHIPS Incentives Program. Eligible projects include equipment replacement or upgrade, addition of new semiconductor manufacturing equipment, and cleanroom expansion. CPO determined the proposed action would not result in significant adverse environmental effects, so no EIS is required. The Final PEA responds to public comments received on the Draft PEA published December 27, 2023.